SDC Systems offers an expanding selection of time to market solutions for the Intel® XScale™ communications, network security, network processing and storage devices - production ready reference platforms and turnkey OEM application platforms.

ADI Engineering backs our solutions with comprehensive support, rapid customization services, and cost-effective production across all volumes. OEMs can easily leverage ADI's proven designs and extensive XScale™ technical expertise to create and deploy best-in-class products while significantly reducing cost, risk, and time to market.

 
 


The "Roadrunner"

Low Cost IXP23XX Development Board

   




 
 


Roadrunner is a low-cost yet fully-featured, production-ready reference platform based on the Intel® IXP2350 network processor. Roadrunner’s broad-based software support combined with ADI's ability to quickly design and flexibly produce custom derivatives of Roadrunner enable OEMs to take custom products to market faster, at lower cost, and with less development risk.

Roadrunner can easily be used to evaluate the IXP2350, then to develop and test your unique software functionality using off-the-shelf applications and tools from ADI's market-leading partners, or by developing your own application code. Roadrunner is available as a flexible OEM product from ADI (contact us for further details), or in single unit quantities as a development kit with engineering support.

If a custom product design is needed, ADI Engineering maintains the expertise to quickly turn variants of Roadrunner that meet specific production requirements, offering a complete product solution optimized to your specific application. ADI quickly handles all aspects of product development – from initial concept through hardware and software development, prototyping, integration, enclosure design (or use our off-the-shelf 1U enclosure), and certification, followed by OEM production across virtually all volumes or flexible design licensing options.

Key Attributes of Roadrunner • Low-cost single board solution, not chassis-based
• ATX form factor allows 1U/19” mounting
• Simple, low-cost, focused on GbE connectivity
• Expansion capability for media interface cards, auxiliary control plane modules, crypto offload
• Truly production ready – not just a demo board:

– Optimized BOM
– Design easily depopulated or respun to specific customer requirements
– Optimized for manufacturability and testability
– 1U chassis available from ADI
– Off-the-shelf diagnostic, manufacturing functional test, and POST
– Easily re-spun for derivative boards

• MontaVista Linux BSP preview kit and RedBoot included
• Intel SDK Software Framework for Roadrunner supplied and supported by ADI
• Application in a Flash extended to the IXP2350 by ADI, Parallogic and Teja to provide complete pre-built application demos, immediately enabling out-of-the-box full evaluation of the IXP2350 in a variety of real-world applications:

– IPv4 Forwarding w/ NAT
– IPv4 Forwarding w/ QoS / DiffServ
– ATM RAN
– IP RAN
– IPv6/v4 dual stack forwarding
– Others
• Application in a Flash supported with CompactFlash

Application in a Flash Program

Unique to ADI’s IXP2350 platform is the Application in a Flash program – where leading application software partners including Parallogic and Teja provide real-world applications ready to run on Roadrunner immediately – just insert a pre-programmed CompactFlash module and apply power. With Roadrunner and the Application in a Flash program, you can quickly and effortlessly evaluate the IXP2350 and application code from ADI's software partners for functionality, performance, and interoperability on live data in your application setting. Demo applications include IPv4 Forwarding, IPv4 Forwarding w/ NAT, IPv4 Forwarding w/ QoS / DiffServ, VPN, ATM RAN, IP RAN, and IPv6/v4 dual stack forwarding.

Roadrunner Block Diagram

Hardware Feature Set Definition

• Intel IXP2350 Network Processor at 900 MHz
• Gigabit Ethernet (x2) based on Marvell 88E1111 PHY – Copper supported on main Roadrunner board; Fiber supported via optional daughtercard
• 10/100 Ethernet (x1) development port
• DDR RAM:
– CPP Bus - 512 MB with ECC via DIMM (expandable to 2GB)
– XSI Bus - 256 MB with ECC (soldered to main board - pad-out for 1 GB)
• QDR SRAM:
– 8 MB, soldered to main board (pad-out for 16 MB)
• Flash: 64 MB StrataFlash, soldered to main board
• CompactFlash: High-density, mechanically robust support for Application in a Flash; CF Rev 2.1 support

• PCI:
– 1x Card-slot, 64-bit, 66 MHz, 3.3V (Crypto offload)
– 1x PrPMC, 64-bit, 66 MHz, 3.3V (Aux cntrl plane CPU)
– 2x MiniPCI Type III, 32-bit, 33 MHz (802.11, 802.16)

• MSF Expansion (IXA Media Interface Mezzanine)
– Optional MIM cards for T1/E1, OC3/12, SLICs, DSL, etc. available off-the-shelf from Intel or developed by ADI for customers
– Compatible with Intel IXDP2401 option cards

• ATA/IDE Controller
• USB 2.0 Host (4 ports)
• Cavium or Hifn encryption engine option:
– Full 1 Gb performance – when NPE crypto not enough
– Look-aside topology via standard PCI module
– Future in-line topology via IXA Media Interface
Mezzanine secure GbE card being planned by ADI card

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